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Dr Tianhong Gu is presently an Assistant Professor in Materials Science and Engineering, the Department of Civil Engineering at Xi'an Jiaotong-Liverpool University (XJTLU). Previously she pursued material research in the UK as a Research Associate (2018-2021) at Imperial College London and a Research Fellow (2021-2022) at the University of Birmingham, with a focus on material microstructure control & design, in-situ micromechanical testing & microstructural characterisation and materials modelling to develop cross-disciplinary solutions for the next generation high-performance and substantial-reliability engineering materials in aerospace, automotive, electronics and nuclear applications. She is a specialist in understanding micromechanical deformation and microstructure, as well as in-situ microscope methods and analysis.

Dr Gu graduated with M.Phil. in Materials Science and Metallurgy from University of Cambridge in 2014 and obtained a Ph.D. in Materials Science and Engineering from Imperial College London in 2018.

Please get in touch if your research interests align with materials engineering, materials characterisation & modelling. I accept applications from PhD students. For further details about PhD opportunities, please contact me.

Qualifications
- Ph.D. in Materials Science and Engineering, Imperial College London, UK - 2018
- M.Phil. in Materials Science and Metallurgy (Downing College), University of Cambridge, UK - 2014
Experience
- Assistant Professor, Department of Civil engineering, Xi’an Jiaotong-Liverpool University, present
- Research Fellow, School of Metallurgy and Materials, University of Birmingham, 2021-2022
- Research Associate, Department of Materials, Imperial College London, 2018-2021
Research interests
- Industrial applications in microelectronics (electronic interconnection), nuclear energy, aerospace and automotive
- Mechanical behaviour and failure mechanism of engineering alloys
- Advanced materials characterisation (In-situ microscope and analysis)
- Micromechanics and materials modelling
Articles
- Yilun Xu, *Tianhong Gu, Jingwei Xian, Finn Giuliani, T. Ben Britton, Christopher M. Gourlay, and Fionn P.E. Dunne. “Multi-scale plasticity homogenization of Sn–3Ag-0.5 Cu: From β-Sn micropillars to polycrystals with intermetallics.” Materials Science and Engineering (2022): A 855, 143876.
- Tianhong Gu, Christopher M. Gourlay, and T. Ben Britton. "The role of lengthscale in the creep of Sn-3Ag-0.5 Cu solder microstructures." Journal of Electronic Materials 50 (2021): 926-938.
- Tianhong Gu, Vivian Tong, Christopher M. Gourlay, and T. Ben Britton. "In-situ study of creep in Sn-3Ag-0.5 Cu solder." Acta Materialia 196 (2020): 31-43.
- Tianhong Gu, Yilun Xu, Christopher M. Gourlay, and T. Ben Britton. "In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5 Cu/Cu solder joint." Scripta Materialia 175 (2020): 55-60.
- Yilun Xu, *Tianhong Gu, Jingwei Xian, Finn Giuliani, T Ben Britton, Christopher Gourlay, Fionn Dunne. “Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder.” International Journal of Plasticity 137, (2021): 102904.
- Tianhong Gu, Christopher M. Gourlay, and T. Ben Britton. "Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5 Cu solder." Journal of Electronic Materials 48, no. 1 (2019): 107-121.
- James Dean, *T. Gu, and T. W. Clyne. "Evaluation of residual stress levels in plasma electrolytic oxidation coatings using a curvature method." Surface and Coatings Technology 269 (2015): 47-53.
Conference presentations
- TMS Conference & Exhibition - ‘Effect of content of intermetallic compounds on creep in controlled microstructure of tin-based solders’ at Anaheim, California, USA, 2022.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘The role of length-scale in the creep of Sn-3Ag-0.5Cu solder with controlled microstructure’, online, UK, 2021.
- The 19th International Conference on Textures of Materials (ICOTOM 19) - ‘In-situ observations of microstructure evolution and damage during creep of Pb-free solder’, Osaka, Japan, 2021.
- Sino-UK, Central Asia Forum and Lightweight Materials Seminar - 'Micromechanical Characterisation of Solder Alloys’, Nanjing, China, 2020.
- Oxford Micromechanics Group (OMG) - ‘Microstructure & Micromechanics of Solder Alloys’ at the University of Oxford, Oxford, UK, 2020.
- TMS Conference & Exhibition - ‘Micropillar Compression Test of Tin-solder microstructural units to reveal slip activities’ at Convention Centre, San Diego, USA, 2020.
- Engineering Alloys Seminar - ‘Microstructural evolution and damages of SAC305 solder alloys during creep and thermal cycling’ at Imperial College London, London, 2019.
- RMS Electron Backscatter Diffraction (EBSD) Conference -‘In-situ EBSD and FSD based observations of creep SAC305 solder’ at National Physical Laboratory (NPL), UK, 2019.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5Cu solder’ at Sherwell Centre, University of Plymouth, UK, 2018.
- TMS Conference & Exhibition - ‘Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5Cu solder’ at Phoenix Convention Centre, USA, 2018.
- The National Student Conference in Metallic Materials - ‘Observations of microstructure evolution and damage during creep testing of Sn-3Ag-0.5Cu solder alloys’ at the Edge, Endcliffe Student Village, University of Sheffield, UK, 2017.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘In-situ observations of crystal orientation change and damage during thermal cycling of Pb-free solder joints’ at Lady Margaret Hall, University of Oxford, UK, 2017.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘Observations of Microstructure Evolution and Damage of Solder Alloys during thermal and mechanical loading’ at Manchester Conference Centre, Manchester, UK, 2016.
Grants
- • Gu, Tianhong, 2023, Principal Investigator (2023-2026), “Green Electronic Interconnections: Optimal Design for Lead-free Solders”, RDF-22-02-014
- • Gu, Tianhong, 2023, Principal Investigator (2023-2026), “Green Electronic Interconnections: Optimal Design for Lead-free Solders”, PGRS2306058
- • Gu, Tianhong, 2023, Principal Investigator, (2023-2026) “Data-driven intelligent design methodology of flexible roll forming process”, FOS2305JM01*
Teaching activities
- CEN425 Experimental Methods in Materials & Mechanics (MRes / MSc module)
- CEN412 Characterization of Materials (MRes module)
Courses taught
- CEN102 / IND106 Fluid Mechanics and Thermodynamics (BEng module)
- CEN425 Experimental Methods in Materials & Mechanics (MRes / MSc module)
- CEN412 Characterization of Materials (MRes module)

电话
+86 (0)51289165332
Email
Tianhong.Gu@xjtlu.edu.cn
地址
EB558(SIP Campus-Engineering Building(EB))
Suzhou Dushu Lake Science and Education Innovation District
Suzhou Industrial Park
Suzhou
P.R.China
215123

Tianhong GuPh.D.

Profile

Qualifications

Experience

Research interests

Articles

Conference presentations

Grants

Teaching activities

Courses taught